I-HDI PCB eyenza efekthri ye-PCB ezenzakalelayo --- ENEPIG PCB surface finish
Kuthunyelwe:Feb 03, 2023
Izigaba: Amabhulogi
Omaka: pcb,pcba,umhlangano we-pcb,ukukhiqiza i-pcb, pcb surface finish,HDI
I-ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) ayisona isiphetho se-PCB esisetshenziswa kakhulu njengamanje ngenkathi isithandwa kakhulu embonini yokukhiqiza ye-PCB.Isebenza ezinhlobonhlobo zezinhlelo zokusebenza isb, amaphakheji angaphezulu ahlukahlukene kanye namabhodi e-PCB athuthuke kakhulu.I-ENEPIG inguqulo ebuyekeziwe ye-ENIG, ngokwengezwa kwesendlalelo se-Palladium (0.1-0.5 µm/4 kuya ku-20 μ'') phakathi kwe-Nickel (3-6 µm/120 – 240 μ'') negolide (0,02- 0,05 µm/1 kuya ku-2 μ'') ngenqubo yamakhemikhali yokucwiliswa embonini ye-PCB.I-palladium isebenza njengesithiyo sokuvikela ungqimba lwe-nickel ekugqwaleni yi-Au, esiza ukuvimbela "iphedi elimnyama" ukuthi lingenzeki okuyinkinga enkulu ye-ENIG.
Uma kungekho ukuboshelwa kwesabelomali, i-ENEPIG ibonakala iyinketho engcono ezimweni eziningi ikakhulukazi zezidingo ezidinga kakhulu ngezinhlobo zamaphakheji amaningi njenge, izimbobo, i-SMT, i-BGA, i-wire bonding, nokulingana kokucindezela, uma kuqhathaniswa ne-ENIG.
Ngaphezu kwalokho, ukuqina nokumelana okuhle kakhulu kuyenza impilo yeshalofu ende.Ijazi lokucwilisa elizacile lenza ukubekwa kwezingxenye nokusoda kube lula futhi kuthembekile.Ngaphezu kwalokho, i-ENEPIG inikeza inketho ephezulu enokwethenjelwa ye-Wire Bonding.
Okuhle:
• Kulula ukucubungula
• I-Black Pad Free
• Indawo eyisicaba
• Impilo yeshelufu enhle kakhulu (izinyanga eziyi-12+)
• Ukuvumela imijikelezo eminingi yokugeleza kabusha
• Kuhle kakhulu ku-Plated Through Holes
• Kuhle ku-Fine Pitch / BGA / Izingxenye Ezincane
• Ilungele Othintana Naye Ngokuthinta / Othintana Naye Nge-Push
• I-Higher Reliability Wire Bonding (igolide/i-aluminium) kune-ENIG
• Ukuthembeka Kwe-Solder Okunamandla kune-ENIG;Akha amajoyinti e-Ni/Sn athembekile
• Ihambisana kakhulu namasoda e-Sn-Ag-Cu
• Ukuhlola Okulula
Ububi:
• Akubona bonke abakhiqizi abangakunikeza.
• Ukumanzi kuyadingeka isikhathi eside.
• Izindleko eziphakeme
• Ukusebenza kahle kuthintwa izimo zokucwenga
• Ingase ingathembeki kangako ekuhlanganisweni kwentambo yegolide uma iqhathaniswa ne-Soft Gold
Ukusetshenziswa okuvame kakhulu:
Ama-High Density Assemblies, Complex or Mixed Package Technologies, High Performance Devices, Wire Bonding application, IC carrier PCBs, njll.
Emuvakuma-Blogs
Isikhathi sokuthumela: Feb-02-2023
