Ukwenziwa kwe-HDI PCB ---Immersion Gold surface treatment
Kuthunyelwe:Jan 28, 2023
Izigaba: Amabhulogi
Omaka: pcb,pcba,umhlangano we-pcb,ukukhiqiza i-pcb, pcb surface finish
I-ENIG ibhekisa ku-Electroless Nickel/Immersion Gold, ebuye ibizwe ngekhemikhali i-Ni/Au, ukusetshenziswa kwayo sekudume kakhulu manje ngenxa yokuziphendulela kwemithetho engakhokhelwa kanye nokufaneleka kwayo kumkhuba wamanje wokuklama we-PCB we-HDI kanye nemigodi emihle phakathi kwama-BGA nama-SMTs. .
I-ENIG iyinqubo Yekhemikhali enamathisela ithusi eliveziwe ngeNickel Negolide, ngakho-ke iqukethe ungqimba oluphindwe kabili lwe-metallic coating, 0.05-0.125 µm (2-5μ amayintshi) yokucwiliswa kwegolide (Au) ngaphezu kuka-3-6 µm (120- 240μ amayintshi) we-Nickel engenawo ugesi (Ni) njengoba kunikeziwe kusithenjwa esivamile.Phakathi nenqubo, i-Nickel ifakwa ezindaweni zethusi ezenziwe nge-palladium-catalyzed, kulandelwa igolide elinamathela endaweni efakwe i-nickel ngokushintshaniswa kwamangqamuzana.I-nickel enamathela ivikela ithusi ku-oxidation futhi isebenze njengendawo yokuhlangana kwe-PCB, futhi isithiyo sokuvimbela ithusi negolide ukuthi lingafudukeli kwelinye, futhi ungqimba oluncane kakhulu lwe-Au luvikela ungqimba lwe-nickel kuze kube yinqubo ye-solder futhi inikeza okuphansi. ukumelana nokuxhumana nokumanzisa okuhle.Lokhu ukujiya kuhlala kuhambisana kulo lonke ibhodi lezintambo eliphrintiwe.Inhlanganisela ikwandisa kakhulu ukumelana nokugqwala futhi inikeze indawo ekahle yokubekwa kwe-SMT.
Inqubo ihlanganisa lezi zinyathelo ezilandelayo:
1) Ukuhlanza.
2) I-micro-etching.
3) Ukucwiliswa kwangaphambili.
4) Ukusebenzisa i-activator.
5) Ngemuva kokucwiliswa.
6) Ukusebenzisa nickel electroless.
7) Ukusebenzisa igolide lokucwiliswa.
Igolide lokucwiliswa ngokuvamile lisetshenziswa ngemva kokusetshenziswa kwemaski ye-solder, kodwa ezimweni ezimbalwa, isetshenziswa ngaphambi kwenqubo ye-solder mask.Ngokusobala, lokhu kuzokhuphuka kakhulu izindleko uma yonke ithusi igcwele igolide hhayi nje lokho okuvezwa ngemuva kwemaski ye-solder.
Umdwebo ongenhla obonisa umehluko phakathi kwe-ENIG nezinye iziphetho zegolide.
Ngobuchwepheshe, i-ENIG iyisixazululo esifanelekile sama-PCB esingaholeli kusukela ekubeni i-planarity yayo ehamba phambili kanye nokufana kwayo, ikakhulukazi i-HDI PCB ene-VFP, i-SMD ne-BGA.I-ENIG ikhethwa ezimeni lapho ukubekezelelana okuqinile kudingwa izinto ze-PCB njengezimbobo ezipuletiwe kanye nobuchwepheshe bokulingana kokucindezela.I-ENIG ifanele futhi i-wire (Al) yokuhlanganisa i-solder.I-ENIG inconyelwa kakhulu ezidingweni zamabhodi ezibandakanya izinhlobo zokudayiswa ngenxa yokuthi ihambisana nezindlela zokuhlanganisa ezihlukene ezifana ne-SMT, ama-flip chips, i- Through-Hole soldering, i-wire bonding, kanye nobuchwepheshe bokulingana kokucindezela.I-electroless Ni/A surface iyama ngemijikelezo eminingi yokushisa nokubamba ukubola.
I-ENIG ibiza ngaphezu kwe-HASL, i-OSP, i-Immersion Silver kanye ne-Immersion Tin.Iphedi elimnyama noma i-Black phosphorus pad ngezinye izikhathi kwenzeka ngesikhathi senqubo lapho ukunqwabelana kwe-phosphorus phakathi kwezingqimba kubangela ukuxhumana okunephutha nezindawo eziphukile.Okunye okubi okuvelayo yizici ezingathandeki kazibuthe.
Okuhle:
- I-Flat Surface - Ilungele ukuhlangana kwephimbo elihle (BGA, QFP…)
- Ukuba ne-solderability enhle kakhulu
- Impilo Yeshelufu Ende (cishe izinyanga eziyi-12)
- Ukumelana okuhle kokuxhumana
- Kuhle kakhulu kuma-PCB ethusi aminyene
- Incamela i-PTH
- Ilungele ama-flip chips
- Ifanele i-Press-fit
- I-wire Bondable (Lapho I-Aluminium Wire Isetshenziswa)
- Excellent conductivity kagesi
- Ukukhipha ukushisa okuhle
Ububi:
- Kuyabiza
- Iphedi ye-phosphorus emnyama
- Ukuphazamiseka kwe-electromagnetic, Ukulahleka Kwesiginali Okubalulekile kuma-high-frequency
- Ayikwazi Ukuphinda Isebenze
- Ayifanele I-Touch Contact Pads
Ukusetshenziswa okuvame kakhulu:
- Izingxenye zangaphezulu eziyinkimbinkimbi njenge-Ball Grid Arrays (BGAs), Amaphakheji we-Quad Flat (QFPs).
- Ama-PCB aneMixed Package Technologies, press-fit, PTH, wire bonding.
- Ama-PCB ane-wire bonding.
- Izinhlelo zokusebenza ezinokwethenjelwa okuphezulu, isibonelo ama-PCB ezimbonini lapho ukunemba nokuqina kubalulekile, njenge-aerospace, amasosha, ezokwelapha kanye nabathengi abasezingeni eliphezulu.
Njengomhlinzeki wezixazululo oholayo we-PCB ne-PCBA onolwazi lweminyaka engaphezu kwe-15, i-PCB ShinTech iyakwazi ukuhlinzeka ngazo zonke izinhlobo zokwenziwa kwebhodi le-PCB ngokuqedwa okuguquguqukayo kwendawo.Singasebenza nawe ukuthuthukisa i-ENIG, HASL, OSP kanye namanye amabhodi wesifunda enziwe ngokwezifiso zakho ngezidingo zakho ezithile.Sifaka ama-PCB anenani lokuncintisana engqikithi yensimbi/i-aluminium futhi eqinile, eguquguqukayo, eguquguqukayo eqinile, futhi anento evamile ye-FR-4, i-TG ephezulu noma ezinye izinto.
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Isikhathi sokuthumela: Jan-28-2023
