Ungayikhetha Kanjani I-Surface Finish ye-PCB Yakho Design
Ⅱ Ukuhlola Nokuqhathanisa
Kuthunyelwe: Nov 16, 2022
Izigaba: Amabhulogi
Omaka: pcb,pcba,umhlangano we-pcb,ukukhiqiza i-pcb, pcb surface finish
Kunamathiphu amaningi mayelana nokuqedwa kwendawo, njenge-HASL engenamthofu inenkinga yokuba nesicaba esingaguquki.I-Electrolytic Ni/Au ibiza ngempela futhi uma igolide eliningi lifakwa ku-pad, kungaholela ekuhlanganiseni kwe-brittle solder.Ithini lokucwiliswa linokuwohloka kokuthengiseka ngemva kokuchayeka emijikelezweni yokushisa eminingi, njengasenqubeni yokugeleza kabusha kwe-PCBA ohlangothini olungaphezulu naphansi, njll. Umehluko wokuqedwa kwendawo engenhla udinga ukuqashelwa ngokucacile.Ithebula elingezansi libonisa ukuhlola okuqinile kokuqedwa kwendawo okuvame ukusetshenziswa kwamabhodi esekethe aphrintiwe.
Ithebula1 Incazelo kafushane yenqubo yokukhiqiza, okuhle nokubi okubalulekile, kanye nokusetshenziswa okujwayelekile kokuqedwa kwezindawo ezingenamthofu ezidumile ze-PCB.
| I-PCB Surface Finish | Inqubo | Ubukhulu | Izinzuzo | Ukubi | Izicelo Ezijwayelekile |
| I-HASL engenamthofu | Amabhodi e-PCB acwiliswa kubhavu kathayela oncibilikisiwe abese eshaywa ngemimese yomoya oshisayo ukuze abambe oyisicaba kanye nokukhipha i-solder ngokweqile. | 30µin(1µm) -1500µin(40µm) | I-Solderability enhle;Itholakala kabanzi;Ingalungiswa/isetshenzwe kabusha;Ishalofu elide ubude | Izindawo ezingalingani;Ukushaqeka okushisayo;Ukuchama kahle;Ibhuloho le-Solder;Ama-PTH axhunyiwe. | Kusebenza kabanzi;Ifanele amaphedi amakhulu kanye nesikhala;Ayifanele i-HDI ene-<20 mil (0.5mm) iphimbo elihle ne-BGA;Ayilungele i-PTH;Ayifanele i-PCB yethusi ewugqinsi;Ngokuvamile, isicelo: Amabhodi esekethe okuhlola ugesi, ukusoda ngesandla, ezinye izinto zikagesi ezisebenza kahle njenge-aerospace kanye nemishini yezempi. |
| OSP | Ukusebenzisa ikhemikhali inhlanganisela yezinto eziphilayo endaweni yamabhodi okwenza ungqimba lwe-organic metallic ukuvikela ithusi eliveziwe ekugqwaleni. | 46µin (1.15µm) -52µin(1.3µm) | Izindleko eziphansi;Amaphedi afanayo futhi ayisicaba;I-solderability enhle;Kungaba iyunithi nezinye surface finishes;Inqubo ilula;Ingasetshenzwa kabusha (ngaphakathi kweshabhu). | Kuyazwela ekuphatheni;Impilo yeshelufu emfushane.Ukusabalalisa kwe-solder okulinganiselwe kakhulu;Ukucekelwa phansi kwe-solderability nge-temp ephakeme nemijikelezo;I-Nonconductive;Kunzima ukuhlola, i-ICT probe, i-ionic & nokukhathazeka kwabezindaba | Kusebenza kabanzi;Ifaneleke kahle i-SMT/imigodi emihle/i-BGA/izingxenye ezincane;Khonza amabhodi;Ayilungele ama-PTH;Ayilungele ubuchwepheshe be-crimping |
| ENIG | Inqubo Yekhemikhali enamathisela ithusi eliveziwe nge-Nickel negolide, ngakho iqukethe ungqimba oluphindwe kabili lwe-metallic coating. | 2µin (0.05µm)– 5µin (0.125µm) wegolide ngaphezu kuka-120µin (3µm)– 240µin (6µm) we-Nickel | I-solderability enhle kakhulu;Amaphedi ayisicaba futhi afanayo;Al wire bendability;Ukumelana nokuxhumana okuphansi;Impilo yeshelufu ende;Ukumelana nokugqwala okuhle nokuqina | "I-Black Pad" ukukhathazeka;Ukulahlekelwa kwesignali kwezinhlelo zokusebenza zesignali zobuqotho;ayikwazi ukusebenza kabusha | Kuhle kakhulu ekuhlanganiseni iphimbo elihle kanye nokubekwa kwentaba okuyinkimbinkimbi (BGA, QFP…);Kuhle kakhulu ngezinhlobo eziningi ze-Soldering;Okuncamelayo ku-PTH, cindezela ukulingana;I-wire Bondable;Ncoma i-PCB enokwethenjelwa okuphezulu okufana ne-aerospace, amasosha, abathengi bezokwelapha nabasezingeni eliphezulu, njll.;Akunconyelwe ukuthintana namaphedi othintana naye. |
| I-Electrolytic Ni/Au (Igolide elithambile) | 99.99% okuhlanzekile - 24 carat Gold isetshenziswe phezu kwe-nickel layer ngenqubo ye-electrolytic ngaphambi kwe-soldermask. | 99.99% Igolide elimsulwa, 24 Karat 30µin (0.8µm) -50µin (1.3µm) ngaphezu kuka-100µin (2.5µm) -200µin (5µm) we-Nickel | Indawo eqinile, eqinile;I-conductivity enkulu;Ukucaba;Al wire bendability;Ukumelana nokuxhumana okuphansi;Impilo yeshelufu ende | Kuyabiza;I-au embrittlement uma iminyene kakhulu;Izithiyo zesakhiwo;Ukucubungula okwengeziwe/ukusebenza kanzima;Hhayi isudi ye-soldering;I-coating ayifani | Isetshenziswa kakhulu ekuxhumaneni kwentambo (i-Al & Au) kuphakheji ye-chip efana ne-COB (Chip on Board) |
| I-Electrolytic Ni/Au (Igolide eliqinile) | 98% okumsulwa - 23 carat Igolide elineziqinisekiso zengezwe kubhavu wokucwenga osetshenziswa phezu kongqimba lwe-nickel ngenqubo ye-electrolytic. | 98% Igolide elimsulwa, 23 Karat30µin(0.8µm) -50µin(1.3µm) ngaphezu kuka-100µin(2.5µm) -150µin(4µm) we-Nickel | I-solderability enhle kakhulu;Amaphedi ayisicaba futhi afanayo;Al wire bendability;Ukumelana nokuxhumana okuphansi;Isebenza kabusha | Ukugqwala (ukuphatha nokugcina) endaweni yesibabule esiphezulu;Izinketho ezincishisiwe ze-supply chain ukusekela lesi siphetho;Iwindi elifushane lokusebenza phakathi kwezigaba zomhlangano. | Isetshenziselwa kakhulu ukuxhumana kukagesi njengezixhumi zonqenqema (umunwe wegolide), amabhodi esithwali se-IC (PBGA/FCBGA/FCCSP...) , Amakhibhodi, abathintwayo bebhethri namanye amaphedi okuhlola, njll. |
| Ukucwiliswa Ag | ungqimba lweSiliva lufakwa endaweni yethusi ngenqubo yokucwenga engena-electroless ngemva kwe-etch kodwa ngaphambi kwe-soldermask. | 5µin(0.12µm) -20µin(0.5µm) | I-solderability enhle kakhulu;Amaphedi ayisicaba futhi afanayo;Al wire bendability;Ukumelana nokuxhumana okuphansi;Isebenza kabusha | Ukugqwala (ukuphatha nokugcina) endaweni yesibabule esiphezulu;Izinketho ezincishisiwe ze-supply chain ukusekela lesi siphetho;Iwindi elifushane lokusebenza phakathi kwezigaba zomhlangano. | Enye indlela yezomnotho ye-ENIG ye-Fine Traces kanye ne-BGA;Ilungele isicelo samasignali esivinini esikhulu;Ilungele ukushintshwa kwe-membrane, ukuvikela kwe-EMI, nokubopha ngocingo lwe-aluminium;Ifanele i-press fit. |
| Ukucwiliswa Sn | Ebhavini lamakhemikhali elingenawo ugesi, ungqimba olumhlophe oluncane lwe-Tin lufaka ngqo ekhopha lamabhodi esekethe njengesithiyo sokugwema ukugcotshwa kwe-oxidation. | 25µin (0.7µm) -60µin(1.5µm) | Okungcono kakhulu kobuchwepheshe bokufaneleka kokucindezela;Kuqiza kahle;I-Planar;I-solderability enhle kakhulu (uma isanda) nokuthembeka;Ukucaba | Ukuwohloka kwe-solderability ngezinga lokushisa eliphakeme & imijikelezo;Ithini eliveziwe ekuhlanganisweni kokugcina lingagqwala;Ukusingatha izinkinga;I-Tin Wiskering;Ayifanele i-PTH;Iqukethe i-Thiourea, i-Carcinogen eyaziwayo. | Ncoma ngenani elikhulu lemikhiqizo;Ilungele ukubekwa kwe-SMD, i-BGA;Okungcono kakhulu kokulingana kokucindezela kanye nezindiza ezingemuva;Akunconyelwe i-PTH, ukushintshwa kokuxhumana, nokusetshenziswa ngamamaski acwengeka |
Ithebula2 Ukuhlolwa kwezakhiwo ezijwayelekile ze-PCB Surface Finishes yesimanje ekukhiqizeni nasekusetshenzisweni
| Ukukhiqizwa kwezindawo ezivame ukusetshenziswa kakhulu zokuqeda | |||||||||
| Izakhiwo | ENIG | ENEPIG | Igolide Elithambile | Igolide eliqinile | IAg | ISn | I-HASL | I-HASL- LF | OSP |
| Ukuduma | Phezulu | Phansi | Phansi | Phansi | Maphakathi | Phansi | Phansi | Phezulu | Maphakathi |
| Izindleko Zokucubungula | Phezulu (1.3x) | Phezulu (2.5x) | Phezulu (3.5x) | Phezulu (3.5x) | Okumaphakathi (1.1x) | Okumaphakathi (1.1x) | Phansi (1.0x) | Phansi (1.0x) | Okuphansi kakhulu (0.8x) |
| Idiphozithi | Ukucwiliswa | Ukucwiliswa | I-Electrolytic | I-Electrolytic | Ukucwiliswa | Ukucwiliswa | Ukucwiliswa | Ukucwiliswa | Ukucwiliswa |
| I-Shelf Life | Yinde | Yinde | Yinde | Yinde | Maphakathi | Maphakathi | Yinde | Yinde | Kufushane |
| I-RoHS Iyahambisana | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | No | Yebo | Yebo |
| I-Surface Co-planarity ye-SMT | Kuhle kakhulu | Kuhle kakhulu | Kuhle kakhulu | Kuhle kakhulu | Kuhle kakhulu | Kuhle kakhulu | Impofu | Kuhle | Kuhle kakhulu |
| Ithusi Eliveziwe | No | No | No | Yebo | No | No | No | No | Yebo |
| Ukuphatha | Okuvamile | Okuvamile | Okuvamile | Okuvamile | Okubucayi | Okubucayi | Okuvamile | Okuvamile | Okubucayi |
| Umzamo Wenqubo | Maphakathi | Maphakathi | Phezulu | Phezulu | Maphakathi | Maphakathi | Maphakathi | Maphakathi | Phansi |
| Amandla Okusebenza Kabusha | No | No | No | No | Yebo | Akuphakanyiswanga | Yebo | Yebo | Yebo |
| Ama-Thermal Cycles adingekayo | amaningi | amaningi | amaningi | amaningi | amaningi | 2-3 | amaningi | amaningi | 2 |
| Inkinga yeWhisk | No | No | No | No | No | Yebo | No | No | No |
| I-Thermal Shock (PCB MFG) | Phansi | Phansi | Phansi | Phansi | Phansi Kakhulu | Phansi Kakhulu | Phezulu | Phezulu | Phansi Kakhulu |
| Ukumelana Okuphansi / Isivinini esikhulu | No | No | No | No | Yebo | No | No | No | N/A |
| Izicelo zezindawo ezivame ukusetshenziswa kakhulu zokuqeda | |||||||||
| Izinhlelo zokusebenza | ENIG | ENEPIG | Igolide Elithambile | Igolide Eliqinile | IAg | ISn | I-HASL | I-LF-HASL | OSP |
| Iqinile | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo |
| I-Flex | Kukhawulelwe | Kukhawulelwe | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo |
| I-Flex-Rigid | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Akuncanyelwanga |
| I-Pitch Enhle | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Akuncanyelwanga | Akuncanyelwanga | Yebo |
| I-BGA & μBGA | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Akuncanyelwanga | Akuncanyelwanga | Yebo |
| I-Multiple Solderability | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | Kukhawulelwe |
| Flip Chip | Yebo | Yebo | Yebo | Yebo | Yebo | Yebo | No | No | Yebo |
| Cindezela u-Fit | Kukhawulelwe | Kukhawulelwe | Kukhawulelwe | Kukhawulelwe | Yebo | Kuhle kakhulu | Yebo | Yebo | Kukhawulelwe |
| Nge-Hole | Yebo | Yebo | Yebo | Yebo | Yebo | No | No | No | No |
| I-wire Bonding | Yebo (Al) | Yebo (Al, Au) | Yebo (Al, Au) | Yebo (Al) | Okuguquguqukayo (Al) | No | No | No | Yebo (Al) |
| I-Solder Wettability | Kuhle | Kuhle | Kuhle | Kuhle | Kuhle kakhulu | Kuhle | Impofu | Impofu | Kuhle |
| I-Solder Joint Integrity | Kuhle | Kuhle | Impofu | Impofu | Kuhle kakhulu | Kuhle | Kuhle | Kuhle | Kuhle |
Impilo yeshelufu iyisici esibalulekile okudingeka usicabangele lapho wenza amashejuli akho okukhiqiza.I-Shelf Lifeiyiwindi lokusebenza elivumela ukuqedwa ukuthi kube nokushisela okuphelele kwe-PCB.Kubalulekile ukwenza isiqiniseko sokuthi wonke ama-PCB akho ahlanganiswe ngesikhathi seshalofu.Ngokungeziwe ezintweni kanye nenqubo eyenza ukuqedwa kwangaphezulu, impilo yeshalofu yokuqeda ithonywa kakhulungama-PCBs ukupakisha nokugcina.Umfakisicelo oqinile wendlela yokulondoloza efanele ephakanyiswe imihlahlandlela ye-IPC-1601 izogcina ukushisela nokwethembeka kwabaqedile.
Ithebula 3 Impilo Yeshelufu Ukuqhathaniswa phakathi Kweziqephu Ezidumile Zomhlaba We-PCB
|
| IMPILO YE-SHEL ejwayelekile | Impilo Yeshelufu Ephakanyisiwe | Ithuba Lokusebenza Kabusha |
| I-HASL-LF | Izinyanga eziyi-12 | Izinyanga eziyi-12 | YEBO |
| OSP | Izinyanga ezi-3 | Izinyanga ezi-1 | YEBO |
| ENIG | Izinyanga eziyi-12 | 6 Izinyanga | CHA* |
| ENEPIG | 6 Izinyanga | 6 Izinyanga | CHA* |
| Electrolytic Ni/Au | Izinyanga eziyi-12 | Izinyanga eziyi-12 | NO |
| IAg | 6 Izinyanga | Izinyanga ezi-3 | YEBO |
| ISn | 6 Izinyanga | Izinyanga ezi-3 | YEBO** |
* Ukuze i-ENIG ne-ENEPIG iqedele umjikelezo wokuvuselela ukuze kuthuthukiswe ukumanzisa kwendawo nempilo yeshelufu iyatholakala.
** I-Chemical Tin rework ayiphakanyisiwe.
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Isikhathi sokuthumela: Nov-16-2022
