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Ungayikhetha Kanjani I-Surface Finish ye-PCB Yakho Design

---Umhlahlandlela Wochwepheshe we-PCB Surface Finishes

Ⅰ Yini futhi Kanjani

 Kuthunyelwe:Nov15, 2022

 Izigaba: Amabhulogi

 Omaka: pcb,pcba,umhlangano we-pcb,umkhiqizi we-pcb, ukwenziwa kwe-pcb

Uma kuziwa ekuqedeni okungaphezulu, kunezinketho ezihlukahlukene, isb. I-HASL, i-OSP, i-ENIG, i-ENEPIG, i-Hard Gold, i-ISn, i-IAg, njll. Kwezinye izimo, kungase kube lula ukwenza isinqumo, njengokuxhuma komphetho kuya kanzima. igolide;I-HASL noma i-HASL-free ikhetha ukubekwa kwezingxenye ezinkulu ze-SMT.Nokho, kungase kube ubuqili ukukukhethela isiphetho esisodwa samabhodi e-HDI ane-Ball Grid Arrays (BGAs) uma zingekho ezinye izinkomba.Kunezici ezifana nesabelomali sakho sale phrojekthi, izidingo zokwethembeka noma izithiyo zesikhathi sokusebenza zidinga ukucatshangelwa kwezinye izimo.Uhlobo ngalunye lwe-PCB surface finish lunobuhle nobubi balo, kungase kudide abaklami be-PCB ukunquma ukuthi iyiphi elungele amabhodi akho e-PCB.Silapha ukuze sikusize ukuthi uzibonele ngesipiliyoni sethu seminyaka eminingi njengomkhiqizi.

1. Iyini i-PCB surface finish

Ukusebenzisa isiphetho esingaphezulu (ukwelashwa okungaphezulu / ukumbozwa kwendawo) kungesinye sezinyathelo zokugcina zokwenza ama-PCB.Indawo engaphezulu yakha ukuxhumana okubalulekile phakathi kwebhodi le-PCB elingenalutho kanye nezingxenye, ezisebenzela izinjongo ezimbili ezibalulekile, ukuhlinzeka ngendawo ethengiswayo yomhlangano we-PCB kanye nokuvikela ithusi elisele elidaluliwe kufaka phakathi imikhondo, amaphedi, izimbobo kanye nezindiza eziphansi ekungcolisweni noma ekungcolisweni, kuyilapho imaski ye-solder ihlanganisa iningi lesifunda.

Ukuqedwa komphezulu kubalulekile ekwenzeni i-PCB i-PCB ShinTech.Ukuhlinzeka ngendawo ethengiswayo yokuhlanganiswa kwe-PCB nokuvikela ithusi eliveziwe ekungcolisweni nasekungcolisweni.

Ukuqedwa kwendawo yesimanje akunawo umthofu, ngokuhambisana neziqondiso Zokukhawulelwa Kwezinto Eziyingozi (i-RoHS) kanye Nezisetshenziswa Kagesi Nezogesi Ezingcolile (WEEE).Izinketho zesimanje zokuqeda i-PCB zifaka:

  • ● LF-HASL (Lead Free Hot Air Solder Leveling)
  • ● I-OSP (Organic Solderability Preservatives)
  • ● ENIG (Electroless Nickel Immersion Gold)
  • ● ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
  • ● Electrolytic Nickel/Gold - Ni/Au (Hard/Soft Gold)
  • ● I-Immersion Silver, IAg
  • Ithini Elimhlophe noma I-Immersion Tin, ISn

2. Ungayikhetha kanjani i-surface finish ye-PCB yakho

Uhlobo ngalunye lwe-PCB surface finish lunobuhle nobubi balo, kungase kudide abaklami be-PCB ukunquma ukuthi iyiphi elungele amabhodi akho e-PCB.Ukukhetha okulungile kumklamo wakho kudinga ukucabangela izici eziningi njengokulandelayo.

  • ★ Budge
  • ★ Amabhodi wesifunda sokugcina isicelo imvelo (isibonelo lokushisa, vibration, RF).
  • ★ Izidingo zomfakisicelo wamahhala, ovumelana nemvelo.
  • ★ Imfuneko yokwethembeka yebhodi le-PCB.
  • ★ Uhlobo lwezingxenye, ukuminyana noma izidingo zokuhlanganisa isib. i-press fit, i-SMT, i-wire bonding, i-Phry-hole soldering, njll.
  • ★ Izidingo zokuthi flatness ebusweni SMT pads for BGA isicelo.
  • ★ Izimfuneko zempilo yeshelufu nokusebenza kabusha kokuqedwa kwendawo.
  • ★ Ukumelana nokushaqeka/ukwehla.Isibonelo, i-ENIG ayilungele umakhalekhukhwini njengoba i-smart phone idinga amabhondi e-tin-copper ukuze ashaqeke kakhulu futhi amelane nokuwa esikhundleni samabhondi e-tin-nickel.
  • ★ Ubuningi Nokuphuma.Ngomthamo ophezulu wama-PCB, ithini yokucwilisa ingaba izinketho ezinokwethenjelwa futhi ezingabizi kakhulu kune-ENIG kanye ne-Immersion Silver kanye nezinkinga zokuzwela ezingagwenywa.Ngokuphambene nalokho, isiliva lokucwiliswa lingcono kune-ISn eqoqweni elincane.
  • ★ Ukuba sengozini kokugqwala noma ukungcola.Isibonelo, ukucwiliswa kwesiliva kokucwiliswa kujwayele ukugqwala.Kokubili i-OSP kanye ne-Immersion tin kuyazwela ekuphatheni umonakalo.
  • ★ Ubuhle bebhodi, njll.

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