izindaba

Kubakhiqizi be-PCB bamabhodi e-HDI, i-laser drill iyisinqumo esifanele sokumba ama-microvias anembile.Lawa ma-microvias mancane ngosayizi futhi adinga ukumba ukujula okulawulwayo.Lokhu kunemba ngokuvamile kungafezwa ngokuzivivinya kwe-lasers.I-Laser drilling yinqubo esebenzisa amandla e-laser agxile kakhulu ekubholeni (ukuhwashisa) imbobo.Ukubhola nge-laser kudala izimbobo ezinembile ebhodini le-PCB ukuze kuqinisekiswe ukunemba ngisho nalapho usebenzisana namasayizi amancane kakhulu.Ama-Lasers angabhola ama-vias angu-2.5 kuya ku-3-mil endaweni eqinisayo yengilazi eyisicaba.Endabeni ye-dielectric engaqinisiwe (engenayo ingilazi), kungenzeka ukubhoboza i-1-mil vias usebenzisa ama-lasers.Ngakho-ke, ukubhoboza nge-laser kunconywa ukumba ama-microvias.

Nakuba singakwazi ukubhoboza ngezimbobo ezinobubanzi obungu-6 mil (0.15 mm) ngezingcezu zokubhoboza eziwumshini, izindleko zamathuluzi zikhuphuka kakhulu njengoba amabhithi amancane okubhoboza aphuka kalula, futhi adinga ukushintshwa njalo.Uma kuqhathaniswa nokubhola ngomshini, izinzuzo zokumba ama-laser zibalwe ngezansi:

• Inqubo yokungaxhumani nabo:I-Laser drilling iyinqubo engathintani ngokuphelele ngakho-ke umonakalo odalwe ku-drill bit kanye nezinto ezibonakalayo ngokudlidliza kokubhoboza uyaqedwa.
• Ukulawula okunembile:Ubukhulu be-beam, ukuphuma kokushisa, kanye nobude be-laser beam kungaphansi kokulawulwa kwamasu okumba nge-laser, ngaleyo ndlela okusiza ukusungula ubujamo bemigodi obuhlukahlukene ngokunemba okuphezulu.Lokhu kubekezelela ± 3 mil njengoba ubuningi buphansi kunomshini wokubhoboza nge-PTH tolerance ±3 mil kanye ne-NPTH tolerance of ±4 mil.Lokhu kuvumela ukwakheka kwama-vias angaboni, angcwatshwe, futhi astakiwe lapho kukhiqizwa amabhodi e-HDI.

• Ukubukeka kwesilinganiselo okuphezulu:Enye yemingcele ebaluleke kakhulu yembobo ebhoboziwe ebhodini lesifunda eliphrintiwe yi-aspect ratio.Imelela ukujula kwembobo kuya kububanzi bembobo ye-via.Njengoba ama-laser angakha izimbobo ezinobubanzi obuncane kakhulu ngokuvamile asukela ku-3-6 mil (0.075mm-0.15mm), ahlinzeka nge-aspect ratio ephezulu.I-Microvia inephrofayili ehlukile uma iqhathaniswa nejwayelekile nge-a, okuholela esicini esihlukile.I-microvia ejwayelekile ine-aspect ratio engu-0.75:1.

• Kuqiza kahle:I-laser drilling ishesha kakhulu kunomshini wokumba, ngisho nokubhola ama-vias abekwe aminyene ebhodini lezingqimba eziningi.Ngaphezu kwalokho, njengoba isikhathi sihamba, izindleko ezengeziwe ezivela ezikhathini eziningi zokushintsha izinsimbi zokubhoboza eziphukile ziyakhuphuka futhi ukubhola ngemishini kungase kubize kakhulu uma kuqhathaniswa nokubhola nge-laser.

• Imisebenzi eminingi:Imishini ye-laser esetshenziselwa ukumba ingasetshenziselwa nezinye izinqubo zokukhiqiza ezifana nokushisela, ukusika, njll.

Abakhiqizi be-PCBube nezinketho ezihlukahlukene zama-lasers.I-PCB ShinTech isebenzisa amalaser e-infrared kanye ne-ultraviolet wavelength ukuze kubhojwe ngenkathi yenza ama-HDI PCB.Inhlanganisela ye-laser ehlukene iyadingeka njengoba abakhiqizi be-PCB basebenzisa izinto ezimbalwa ze-dielectric njenge-resin, i-reinforced prepreg, ne-RCC.

Ubukhulu be-beam, ukuphuma kokushisa, nobude be-laser beam kungahlelwa ngaphansi kwezimo ezihlukene.Imishayo engasheleli kahle ingabhoboza izinto eziphilayo kodwa ishiye izinsimbi zilimale.Ukusika insimbi nengilazi, sisebenzisa imishayo esezingeni eliphezulu.Nakuba imishayo esebenza kancane idinga imishayo yobubanzi obungu-4-14 mil (0.1-0.35 mm), imishayo esebenza kahle idinga imishayo engu-1 mil (0.02 mm) ububanzi.

Ithimba labakhi be-PCB ShinTech liqongelele iminyaka engu-15 yobuchwepheshe ekucutshungulweni kwe-laser futhi lifakazele irekhodi lempumelelo ekuhlinzekweni kwe-HDI PCB, ikakhulukazi ekwenziweni kwe-PCB eguquguqukayo.Izixazululo zethu zenzelwe ukuhlinzeka ngamabhodi wesekethe athembekile kanye nenkonzo yobungcweti ngentengo encintisanayo ukusekela imibono yakho yebhizinisi emakethe ngempumelelo.

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